BibTeX record conf/3dic/NaeimYCBDSBCPBM23

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@inproceedings{DBLP:conf/3dic/NaeimYCBDSBCPBM23,
  author       = {Mohamed Naeim and
                  Hanqi Yang and
                  Pinhong Chen and
                  Rong Bao and
                  Antoine Dekeyser and
                  Giuliano Sisto and
                  Moritz Brunion and
                  Rongmei Chen and
                  Geert Van der Plas and
                  Eric Beyne and
                  Dragomir Milojevic},
  title        = {Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding
                  and TSVs},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2023,
                  Cork, Ireland, May 10-12, 2023},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/3DIC57175.2023.10155075},
  doi          = {10.1109/3DIC57175.2023.10155075},
  timestamp    = {Sat, 30 Sep 2023 09:32:44 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/NaeimYCBDSBCPBM23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}