BibTeX record conf/3dic/NadipalliFLWYT11

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@inproceedings{DBLP:conf/3dic/NadipalliFLWYT11,
  author       = {Revanth Nadipalli and
                  Ji Fan and
                  Holden King Ho Li and
                  Keng Hoong Wee and
                  Hao Yu and
                  Chuan Seng Tan},
  editor       = {Mitsumasa Koyanagi and
                  Morihiro Kada},
  title        = {3D integration of {MEMS} and {CMOS} via Cu-Cu bonding with simultaneous
                  formation of electrical, mechanical and hermetic bonds},
  booktitle    = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
                  Osaka, Japan, January 31 - February 2, 2012},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2011},
  url          = {https://doi.org/10.1109/3DIC.2012.6262956},
  doi          = {10.1109/3DIC.2012.6262956},
  timestamp    = {Tue, 19 Apr 2022 10:38:34 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/NadipalliFLWYT11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}