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BibTeX record conf/3dic/NadipalliFLWYT11
@inproceedings{DBLP:conf/3dic/NadipalliFLWYT11, author = {Revanth Nadipalli and Ji Fan and Holden King Ho Li and Keng Hoong Wee and Hao Yu and Chuan Seng Tan}, editor = {Mitsumasa Koyanagi and Morihiro Kada}, title = {3D integration of {MEMS} and {CMOS} via Cu-Cu bonding with simultaneous formation of electrical, mechanical and hermetic bonds}, booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012}, pages = {1--5}, publisher = {{IEEE}}, year = {2011}, url = {https://doi.org/10.1109/3DIC.2012.6262956}, doi = {10.1109/3DIC.2012.6262956}, timestamp = {Tue, 19 Apr 2022 10:38:34 +0200}, biburl = {https://dblp.org/rec/conf/3dic/NadipalliFLWYT11.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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