BibTeX record conf/3dic/MurugesanBFMTK16

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@inproceedings{DBLP:conf/3dic/MurugesanBFMTK16,
  author       = {Mariappan Murugesan and
                  Jichel Bea and
                  Takafumi Fukushima and
                  Makoto Motoyoshi and
                  Tetsu Tanaka and
                  Mitsumasa Koyanagi},
  title        = {Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed
                  TiSix for via-last {TSV} technology},
  booktitle    = {2016 {IEEE} International 3D Systems Integration Conference, 3DIC
                  2016, San Francisco, CA, USA, November 8-11, 2016},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2016},
  url          = {https://doi.org/10.1109/3DIC.2016.7970017},
  doi          = {10.1109/3DIC.2016.7970017},
  timestamp    = {Fri, 27 Dec 2019 21:20:46 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/MurugesanBFMTK16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}