BibTeX record conf/3dic/MannaVBDRZB11

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@inproceedings{DBLP:conf/3dic/MannaVBDRZB11,
  author       = {Antonio La Manna and
                  Dimitrios Velenis and
                  Thibault Buisson and
                  Mikael Detalle and
                  Kenneth J. Rebibis and
                  Wenqi Zhang and
                  Eric Beyne},
  editor       = {Mitsumasa Koyanagi and
                  Morihiro Kada},
  title        = {3D stacking using ultra thin dies},
  booktitle    = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
                  Osaka, Japan, January 31 - February 2, 2012},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2011},
  url          = {https://doi.org/10.1109/3DIC.2012.6262951},
  doi          = {10.1109/3DIC.2012.6262951},
  timestamp    = {Mon, 19 Jun 2023 09:43:31 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/MannaVBDRZB11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}