BibTeX record conf/3dic/LueckGMHLT13

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@inproceedings{DBLP:conf/3dic/LueckGMHLT13,
  author       = {Matthew Lueck and
                  Chris W. Gregory and
                  Dean Malta and
                  Alan Huffman and
                  John M. Lannon and
                  Dorota Temple},
  title        = {High density interconnect bonding of heterogeneous materials using
                  non-collapsible microbumps at 10 {\(\mu\)}m pitch},
  booktitle    = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
                  San Francisco, CA, USA, October 2-4, 2013},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2013},
  url          = {https://doi.org/10.1109/3DIC.2013.6702387},
  doi          = {10.1109/3DIC.2013.6702387},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/LueckGMHLT13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}