BibTeX record conf/3dic/LiuCTC19

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@inproceedings{DBLP:conf/3dic/LiuCTC19,
  author       = {Demin Liu and
                  Po{-}Chih Chen and
                  Yi{-}Chieh Tsai and
                  Kuan{-}Neng Chen},
  title        = {Low Temperature Cu to Cu Direct Bonding below 150 {\textdegree}C with
                  Au Passivation Layer},
  booktitle    = {2019 International 3D Systems Integration Conference (3DIC), Sendai,
                  Japan, October 8-10, 2019},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2019},
  url          = {https://doi.org/10.1109/3DIC48104.2019.9058873},
  doi          = {10.1109/3DIC48104.2019.9058873},
  timestamp    = {Sun, 19 Apr 2020 18:57:24 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/LiuCTC19.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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