BibTeX record conf/3dic/LiangCLLYC16

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@inproceedings{DBLP:conf/3dic/LiangCLLYC16,
  author       = {Hao{-}Wen Liang and
                  Hsiu{-}Chi Chen and
                  Chien{-}Hung Lin and
                  Chia{-}Lin Lee and
                  Shan{-}Chun Yang and
                  Kuan{-}Neng Chen},
  title        = {The influence of device morphology on wafer-level bonding with polymer-coated
                  layer},
  booktitle    = {2016 {IEEE} International 3D Systems Integration Conference, 3DIC
                  2016, San Francisco, CA, USA, November 8-11, 2016},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2016},
  url          = {https://doi.org/10.1109/3DIC.2016.7970009},
  doi          = {10.1109/3DIC.2016.7970009},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/LiangCLLYC16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}