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BibTeX record conf/3dic/LeeTMNBFTK13
@inproceedings{DBLP:conf/3dic/LeeTMNBFTK13, author = {Kang Wook Lee and Seiya Tanikawa and Mariappan Murugesan and H. Naganuma and Jichoel Bea and Takafumi Fukushima and Tetsu Tanaka and Mitsumasa Koyanagi}, title = {Impact of 3-D integration process on memory retention characteristics in thinned {DRAM} chip for 3-D memory}, booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013}, pages = {1--4}, publisher = {{IEEE}}, year = {2013}, url = {https://doi.org/10.1109/3DIC.2013.6702336}, doi = {10.1109/3DIC.2013.6702336}, timestamp = {Tue, 16 Feb 2021 15:53:52 +0100}, biburl = {https://dblp.org/rec/conf/3dic/LeeTMNBFTK13.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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