BibTeX record conf/3dic/KoharaONTM15

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@inproceedings{DBLP:conf/3dic/KoharaONTM15,
  author       = {Sayuri Kohara and
                  Keishi Okamoto and
                  Hirokazu Noma and
                  Kazushige Toriyama and
                  Hiroyuki Mori},
  title        = {Warpage analysis of organic substrates for 2.1D packaging},
  booktitle    = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
                  Japan, August 31 - September 2, 2015},
  pages        = {TS8.17.1--TS8.17.5},
  publisher    = {{IEEE}},
  year         = {2015},
  url          = {https://doi.org/10.1109/3DIC.2015.7334586},
  doi          = {10.1109/3DIC.2015.7334586},
  timestamp    = {Sun, 02 Oct 2022 15:53:09 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/KoharaONTM15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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