BibTeX record conf/3dic/KhurramPBSS16

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@inproceedings{DBLP:conf/3dic/KhurramPBSS16,
  author       = {Kumail Khurram and
                  Asisa Kumar Panigrahi and
                  Satish Bonam and
                  Om Krishan Singh and
                  Shiv Govind Singh},
  title        = {Novel inter layer dielectric and thermal {TSV} material for enhanced
                  heat mitigation in 3-D {IC}},
  booktitle    = {2016 {IEEE} International 3D Systems Integration Conference, 3DIC
                  2016, San Francisco, CA, USA, November 8-11, 2016},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2016},
  url          = {https://doi.org/10.1109/3DIC.2016.7970005},
  doi          = {10.1109/3DIC.2016.7970005},
  timestamp    = {Sun, 25 Oct 2020 22:39:02 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/KhurramPBSS16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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