BibTeX record conf/3dic/KawakitaHC15

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@inproceedings{DBLP:conf/3dic/KawakitaHC15,
  author       = {Jin Kawakita and
                  Barbara Horv{\'{a}}th and
                  Toyohiro Chikyow},
  title        = {Fast filling of through-silicon via {(TSV)} with conductive polymer/metal
                  composites},
  booktitle    = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
                  Japan, August 31 - September 2, 2015},
  pages        = {TS8.14.1--TS8.14.5},
  publisher    = {{IEEE}},
  year         = {2015},
  url          = {https://doi.org/10.1109/3DIC.2015.7334583},
  doi          = {10.1109/3DIC.2015.7334583},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/KawakitaHC15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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