BibTeX record conf/3dic/KangKKLJLKK11

• > Home > conf/3dic/KangKKLJLKK11

@inproceedings{DBLP:conf/3dic/KangKKLJLKK11,
  author       = {Sung{-}Geun Kang and
                  Youngrae Kim and
                  Eun{-}Sol Kim and
                  Naeun Lim and
                  Teakgyu Jeong and
                  Jieun Lee and
                  Sarah Eunkyung Kim and
                  Sungdong Kim},
  editor       = {Mitsumasa Koyanagi and
                  Morihiro Kada},
  title        = {Evaluation of wafer level Cu bonding for 3D integration},
  booktitle    = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
                  Osaka, Japan, January 31 - February 2, 2012},
  pages        = {1--2},
  publisher    = {{IEEE}},
  year         = {2011},
  url          = {https://doi.org/10.1109/3DIC.2012.6263014},
  doi          = {10.1109/3DIC.2012.6263014},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/KangKKLJLKK11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}