BibTeX record conf/3dic/InouePVVHST14

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@inproceedings{DBLP:conf/3dic/InouePVVHST14,
  author       = {Fumihiro Inoue and
                  Harold Philipsen and
                  Marleen H. van der Veen and
                  Kevin Vandersmissen and
                  Stefaan Van Huylenbroeck and
                  Herbert Struyf and
                  Tetsu Tanaka},
  title        = {Cu seeding using electroless deposition on Ru liner for high aspect
                  ratio through-Si vias},
  booktitle    = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale,
                  Ireland, December 1-3, 2014},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2014},
  url          = {https://doi.org/10.1109/3DIC.2014.7152147},
  doi          = {10.1109/3DIC.2014.7152147},
  timestamp    = {Sun, 25 Oct 2020 22:39:03 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/InouePVVHST14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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