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BibTeX record conf/3dic/InouePVVHST14
@inproceedings{DBLP:conf/3dic/InouePVVHST14, author = {Fumihiro Inoue and Harold Philipsen and Marleen H. van der Veen and Kevin Vandersmissen and Stefaan Van Huylenbroeck and Herbert Struyf and Tetsu Tanaka}, title = {Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias}, booktitle = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014}, pages = {1--4}, publisher = {{IEEE}}, year = {2014}, url = {https://doi.org/10.1109/3DIC.2014.7152147}, doi = {10.1109/3DIC.2014.7152147}, timestamp = {Sun, 25 Oct 2020 22:39:03 +0100}, biburl = {https://dblp.org/rec/conf/3dic/InouePVVHST14.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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