BibTeX record conf/3dic/InoueBSPOKKB19

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@inproceedings{DBLP:conf/3dic/InoueBSPOKKB19,
  author       = {Fumihiro Inoue and
                  Julien Bertheau and
                  Samuel Suhard and
                  Alain Phommahaxay and
                  Takuya Ohashi and
                  Tetsuro Kinoshita and
                  Yohei Kinoshita and
                  Eric Beyne},
  title        = {Protective Layer for Collective Die to Wafer Hybrid Bonding},
  booktitle    = {2019 International 3D Systems Integration Conference (3DIC), Sendai,
                  Japan, October 8-10, 2019},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2019},
  url          = {https://doi.org/10.1109/3DIC48104.2019.9058870},
  doi          = {10.1109/3DIC48104.2019.9058870},
  timestamp    = {Thu, 14 Oct 2021 09:53:39 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/InoueBSPOKKB19.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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