BibTeX record conf/3dic/FukushimaBMLK13

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@inproceedings{DBLP:conf/3dic/FukushimaBMLK13,
  author       = {Takafumi Fukushima and
                  Jichoel Bea and
                  Mariappan Murugesan and
                  Kang Wook Lee and
                  Mitsumasa Koyanagi},
  title        = {Development of via-last 3D integration technologies using a new temporary
                  adhesive system},
  booktitle    = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
                  San Francisco, CA, USA, October 2-4, 2013},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2013},
  url          = {https://doi.org/10.1109/3DIC.2013.6702383},
  doi          = {10.1109/3DIC.2013.6702383},
  timestamp    = {Tue, 16 Feb 2021 15:53:52 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/FukushimaBMLK13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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