BibTeX record conf/3dic/FritzschMBTKWWR09

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@inproceedings{DBLP:conf/3dic/FritzschMBTKWWR09,
  author       = {Thomas Fritzsch and
                  Raul Mrossko and
                  Tobias Baumgartner and
                  Michael Toepper and
                  Matthias Klein and
                  J{\"{u}}rgen Wolf and
                  Bernhard Wunderle and
                  Herbert Reichl},
  title        = {3-D thin chip integration technology - from technology development
                  to application},
  booktitle    = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
                  San Francisco, California, USA, 28-30 September 2009},
  pages        = {1--8},
  publisher    = {{IEEE}},
  year         = {2009},
  url          = {https://doi.org/10.1109/3DIC.2009.5306578},
  doi          = {10.1109/3DIC.2009.5306578},
  timestamp    = {Sat, 30 Sep 2023 09:32:44 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/FritzschMBTKWWR09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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