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BibTeX record conf/3dic/FritzschMBTKWWR09
@inproceedings{DBLP:conf/3dic/FritzschMBTKWWR09, author = {Thomas Fritzsch and Raul Mrossko and Tobias Baumgartner and Michael Toepper and Matthias Klein and J{\"{u}}rgen Wolf and Bernhard Wunderle and Herbert Reichl}, title = {3-D thin chip integration technology - from technology development to application}, booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009}, pages = {1--8}, publisher = {{IEEE}}, year = {2009}, url = {https://doi.org/10.1109/3DIC.2009.5306578}, doi = {10.1109/3DIC.2009.5306578}, timestamp = {Sat, 30 Sep 2023 09:32:44 +0200}, biburl = {https://dblp.org/rec/conf/3dic/FritzschMBTKWWR09.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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