BibTeX record conf/3dic/FengWSKA14

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@inproceedings{DBLP:conf/3dic/FengWSKA14,
  author       = {Wei Feng and
                  Naoya Watanabe and
                  Haruo Shimamoto and
                  Katsuya Kikuchi and
                  Masahiro Aoyagi},
  title        = {Analysis of thermal stress distribution for {TSV} with novel structure},
  booktitle    = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale,
                  Ireland, December 1-3, 2014},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2014},
  url          = {https://doi.org/10.1109/3DIC.2014.7152168},
  doi          = {10.1109/3DIC.2014.7152168},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/FengWSKA14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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