BibTeX record conf/3dic/DubarryAMMMCBA21

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@inproceedings{DBLP:conf/3dic/DubarryAMMMCBA21,
  author       = {Christophe Dubarry and
                  Lucile Arnaud and
                  Maria{-}Luisa Calvo{-}Mu{\~{n}}oz and
                  Ga{\"{e}}lle Mauguen and
                  St{\'{e}}phane Moreau and
                  R. Crochemore and
                  Nicolas Bresson and
                  Bernard Aventurier},
  title        = {3D interconnection using copper direct hybrid bonding for GaN on silicon
                  wafer},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021,
                  Raleigh, NC, USA, October 26-29, 2021},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/3DIC52383.2021.9687599},
  doi          = {10.1109/3DIC52383.2021.9687599},
  timestamp    = {Thu, 07 Sep 2023 21:16:35 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/DubarryAMMMCBA21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}