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BibTeX record conf/3dic/ChoiEMJLKK19
@inproceedings{DBLP:conf/3dic/ChoiEMJLKK19, author = {Kwang{-}Seong Choi and Yong{-}Sung Eom and Seok Hwan Moon and Jiho Joo and Kwangjoo Lee and Jung Hak Kim and Ju Hyeon Kim}, title = {Development of Laser-Assisted Bonding with Compression {(LABC)} Process for 3D {IC} Integration}, booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019}, pages = {1--3}, publisher = {{IEEE}}, year = {2019}, url = {https://doi.org/10.1109/3DIC48104.2019.9058890}, doi = {10.1109/3DIC48104.2019.9058890}, timestamp = {Sun, 19 Apr 2020 18:57:24 +0200}, biburl = {https://dblp.org/rec/conf/3dic/ChoiEMJLKK19.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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