BibTeX record conf/3dic/ChewMBMN13a

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@inproceedings{DBLP:conf/3dic/ChewMBMN13a,
  author       = {Jason Chew and
                  Uday Mahajan and
                  Rajeev Bajaj and
                  Iad Mirshad and
                  Robert Newcomb},
  title        = {Characterization and optimization of a {TSV} {CMP} reveal process
                  using a novel wafer inspection technique for detecting sub-monolayer
                  surface contamination},
  booktitle    = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
                  San Francisco, CA, USA, October 2-4, 2013},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2013},
  url          = {https://doi.org/10.1109/3DIC.2013.6702372},
  doi          = {10.1109/3DIC.2013.6702372},
  timestamp    = {Mon, 16 Oct 2023 09:11:53 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/ChewMBMN13a.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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