BibTeX record conf/3dic/ChePHTGG11

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@inproceedings{DBLP:conf/3dic/ChePHTGG11,
  author       = {Fa Xing Che and
                  Wahyuaji Narottama Putra and
                  A. Heryanto and
                  A. Trigg and
                  S. Gao and
                  Chee Lip Gan},
  editor       = {Mitsumasa Koyanagi and
                  Morihiro Kada},
  title        = {Numerical and experimental study on Cu protrusion of Cu-filled through-silicon
                  vias {(TSV)}},
  booktitle    = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
                  Osaka, Japan, January 31 - February 2, 2012},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2011},
  url          = {https://doi.org/10.1109/3DIC.2012.6262985},
  doi          = {10.1109/3DIC.2012.6262985},
  timestamp    = {Sat, 30 Sep 2023 09:32:44 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/ChePHTGG11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}