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BibTeX record conf/3dic/ChePHTGG11
@inproceedings{DBLP:conf/3dic/ChePHTGG11, author = {Fa Xing Che and Wahyuaji Narottama Putra and A. Heryanto and A. Trigg and S. Gao and Chee Lip Gan}, editor = {Mitsumasa Koyanagi and Morihiro Kada}, title = {Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias {(TSV)}}, booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012}, pages = {1--6}, publisher = {{IEEE}}, year = {2011}, url = {https://doi.org/10.1109/3DIC.2012.6262985}, doi = {10.1109/3DIC.2012.6262985}, timestamp = {Sat, 30 Sep 2023 09:32:44 +0200}, biburl = {https://dblp.org/rec/conf/3dic/ChePHTGG11.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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