BibTeX record conf/3dic/BandyopadhyayCCST09

download as .bib file

@inproceedings{DBLP:conf/3dic/BandyopadhyayCCST09,
  author       = {Tapobrata Bandyopadhyay and
                  Ritwik Chatterjee and
                  Daehyun Chung and
                  Madhavan Swaminathan and
                  Rao R. Tummala},
  title        = {Electrical modeling of Through Silicon and Package Vias},
  booktitle    = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
                  San Francisco, California, USA, 28-30 September 2009},
  pages        = {1--8},
  publisher    = {{IEEE}},
  year         = {2009},
  url          = {https://doi.org/10.1109/3DIC.2009.5306542},
  doi          = {10.1109/3DIC.2009.5306542},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/BandyopadhyayCCST09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.