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BibTeX record conf/3dic/AokiHT10
@inproceedings{DBLP:conf/3dic/AokiHT10, author = {Mayu Aoki and Kazuyuki Hozawa and Kenichi Takeda}, title = {Wafer-level hybrid bonding technology with copper/polymer co-planarization}, booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010}, pages = {1--4}, publisher = {{IEEE}}, year = {2010}, url = {https://doi.org/10.1109/3DIC.2010.5751471}, doi = {10.1109/3DIC.2010.5751471}, timestamp = {Wed, 16 Oct 2019 14:14:50 +0200}, biburl = {https://dblp.org/rec/conf/3dic/AokiHT10.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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