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Hideo Ohno

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with Shoun Matsunaga

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Publications

2014
[j10]
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  dblp key:
  - journals/ieiceee/MatsunagaMEOH14
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  persistent URL:
  - https://dblp.org/rec/journals/ieiceee/MatsunagaMEOH14
Shoun Matsunaga, Akira Mochizuki, Tetsuo Endoh, Hideo Ohno, Takahiro Hanyu:
Design of an energy-efficient 2T-2MTJ nonvolatile TCAM based on a parallel-serial-combined search scheme. IEICE Electron. Express 11(3): 20131006 (2014)
[j9]
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  - journals/ieiceee/MatsunagaMSNSEOH14
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  - https://dblp.org/rec/journals/ieiceee/MatsunagaMSNSEOH14
Shoun Matsunaga, Akira Mochizuki, Noboru Sakimura, Ryusuke Nebashi, Tadahiko Sugibayashi, Tetsuo Endoh, Hideo Ohno, Takahiro Hanyu:
Complementary 5T-4MTJ nonvolatile TCAM cell circuit with phase-selective parallel writing scheme. IEICE Electron. Express 11(10): 20140297 (2014)
2012
[c9]
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  dblp key:
  - conf/aspdac/MatsunagaNIMEOH12
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  - https://dblp.org/rec/conf/aspdac/MatsunagaNIMEOH12
Shoun Matsunaga, Masanori Natsui, Shoji Ikeda, Katsuya Miura, Tetsuo Endoh, Hideo Ohno, Takahiro Hanyu:
Implementation of a perpendicular MTJ-based read-disturb-tolerant 2T-2R nonvolatile TCAM based on a reversed current reading scheme. ASP-DAC 2012: 475-476
[c7]
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  dblp key:
  - conf/vlsic/MatsunagaMHKIEO12
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  - https://dblp.org/rec/conf/vlsic/MatsunagaMHKIEO12
Shoun Matsunaga, Sadahiko Miura, Hiroaki Honjou, Keizo Kinoshita, Shoji Ikeda, Tetsuo Endoh, Hideo Ohno, Takahiro Hanyu:
A 3.14 um² 4T-2MTJ-cell fully parallel TCAM based on nonvolatile logic-in-memory architecture. VLSIC 2012: 44-45
2009
[c5]
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  dblp key:
  - conf/date/MatsunagaHIMEOH09
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  - https://dblp.org/rec/conf/date/MatsunagaHIMEOH09
Shoun Matsunaga, Jun Hayakawa, Shoji Ikeda, Katsuya Miura, Tetsuo Endoh, Hideo Ohno, Takahiro Hanyu:
MTJ-based nonvolatile logic-in-memory circuit, future prospects and issues. DATE 2009: 433-435

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