Bing Dang

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with Raymond R. Horton

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Publications

2008
[j5]
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  - journals/ibmrd/KnickerbockerADHIPPSSSSSTTWW08
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John U. Knickerbocker, Paul S. Andry, Bing Dang, Raymond R. Horton, Mario J. Interrante, Chirag S. Patel, Robert J. Polastre, Katsuyuki Sakuma, Ranjani Sirdeshmukh, Edmund J. Sprogis, Sri M. Sri-Jayantha, Antonio M. Stephens, Anna W. Topol, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright:
Three-dimensional silicon integration. IBM J. Res. Dev. 52(6): 553-569 (2008)
[j3]
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  - journals/ibmrd/DangWASTIWPHPSZSK08
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Bing Dang, Steven L. Wright, Paul S. Andry, Edmund J. Sprogis, Cornelia K. Tsang, M. John Interrante, Bucknell C. Webb, Robert J. Polastre, Raymond R. Horton, Chirag S. Patel, Arun Sharma, J. Zheng, Katsuyuki Sakuma, John U. Knickerbocker:
3D chip stacking with C4 technology. IBM J. Res. Dev. 52(6): 599-609 (2008)
[j2]
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  - journals/ibmrd/SakumaATWDPWMSKPHK08
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Katsuyuki Sakuma, Paul S. Andry, Cornelia K. Tsang, Steven L. Wright, Bing Dang, Chirag S. Patel, Bucknell C. Webb, J. Maria, Edmund J. Sprogis, S. K. Kang, Robert J. Polastre, Raymond R. Horton, John U. Knickerbocker:
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections. IBM J. Res. Dev. 52(6): 611-622 (2008)
2005
[j1]
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  - journals/ibmrd/KnickerbockerABDHJKMPPSSSSTWWMSD05
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John U. Knickerbocker, Paul S. Andry, L. Paivikki Buchwalter, Alina Deutsch, Raymond R. Horton, Keith A. Jenkins, Young Hoon Kwark, Gerald McVicker, Chirag S. Patel, Robert J. Polastre, Christian D. Schuster, Arun Sharma, Sri M. Sri-Jayantha, Christopher W. Surovic, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright, Samuel R. McKnight, Edmund J. Sprogis, Bing Dang:
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. IBM J. Res. Dev. 49(4-5): 725-754 (2005)

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