Sophie Verrun

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with Patrick Leduc

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Publications

2009
[c3]
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  dblp key:
  - conf/3dic/CioccioGTSBVZVDLABCCC09
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  persistent URL:
  - https://dblp.org/rec/conf/3dic/CioccioGTSBVZVDLABCCC09
Léa Di Cioccio, Pierric Gueguen, Rachid Taibi, Thomas Signamarcheix, Laurent Bally, Laurent Vandroux, Marc Zussy, Sophie Verrun, Jérôme Dechamp, Patrick Leduc, Myriam Assous, David Bouchu, François de Crecy, Laurent-Luc Chapelon, Laurent Clavelier:
An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling. 3DIC 2009: 1-4
[c1]
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  authority control:
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  dblp key:
  - conf/3dic/LeducACZSRRVBBCFS09
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  persistent URL:
  - https://dblp.org/rec/conf/3dic/LeducACZSRRVBBCFS09
Patrick Leduc, Myriam Assous, Léa Di Cioccio, Marc Zussy, Thomas Signamarcheix, Antonio Roman, Maxime Rousseau, Sophie Verrun, Laurent Bally, David Bouchu, Lionel Cadix, Alexis Farcy, Nicolas Sillon:
First integration of Cu TSV using die-to-wafer direct bonding and planarization. 3DIC 2009: 1-5

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