Paul D. Franzon

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with Steve Lipa

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Publications

2022
[j38]
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Theodros Nigussie, Joshua Schabel, Steve Lipa, Lisa G. McIlrath, Robert Patti, Paul D. Franzon:
Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning. IEEE Trans. Very Large Scale Integr. Syst. 30(9): 1230-1243 (2022)
2019
[c83]
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T. Robert Harris, W. Rhett Davis, Steven Lipa, W. Shepherd Pitts, Paul D. Franzon:
Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages. 3DIC 2019: 1-3
2017
[c79]
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  - conf/iccd/SrinivasanCFWZS17
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Vinesh Srinivasan, Rangeen Basu Roy Chowdhury, Elliott Forbes, Randy Widialaksono, Zhenqian Zhang, Joshua Schabel, Sungkwan Ku, Steve Lipa, Eric Rotenberg, W. Rhett Davis, Paul D. Franzon:
H3 (Heterogeneity in 3D): A Logic-on-Logic 3D-Stacked Heterogeneous Multi-Core Processor. ICCD 2017: 145-152
2016
[c77]
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Randy Widialaksono, Rangeen Basu Roy Chowdhury, Zhenqian Zhang, Joshua Schabel, Steve Lipa, Eric Rotenberg, W. Rhett Davis, Paul D. Franzon:
Physical design of a 3D-stacked heterogeneous multi-core processor. 3DIC 2016: 1-5
2015
[c71]
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Paul D. Franzon, Eric Rotenberg, James Tuck, W. Rhett Davis, Huiyang Zhou, Joshua Schabel, Zhenqian Zhang, J. Brandon Dwiel, Elliott Forbes, Joonmoo Huh, Marcus Tshibangu, Steve Lipa:
Computing in 3D. 3DIC 2015: TS6.1.1-TS6.1.2
[c69]
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Paul D. Franzon, Eric Rotenberg, James Tuck, W. Rhett Davis, Huiyang Zhou, Joshua Schabel, Zhenqian Zhang, J. Brandon Dwiel, Elliott Forbes, Joonmoo Huh, Steve Lipa:
Computing in 3D. CICC 2015: 1-6
[c68]
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  - conf/hotchips/ForbesZWDCSLRDF15
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Elliott Forbes, Zhenqian Zhang, Randy Widialaksono, Brandon H. Dwiel, Rangeen Basu Roy Chowdhury, Vinesh Srinivasan, Steve Lipa, Eric Rotenberg, W. Rhett Davis, Paul D. Franzon:
Under 100-cycle thread migration latency in a single-ISA heterogeneous multi-core processor. Hot Chips Symposium 2015: 1
2014
[c67]
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Paul D. Franzon, Eric Rotenberg, James Tuck, Huiyang Zhou, W. Rhett Davis, Hongwen Dai, Joonmoo Huh, Sungkwan Ku, Steve Lipa, Chao Li, Jong Beom Park, Joshua Schabel:
3D-enabled customizable embedded computer (3DECC). 3DIC 2014: 1-3
2013
[c58]
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  - conf/iccd/RotenbergDFZWCTLDF13
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Eric Rotenberg, Brandon H. Dwiel, Elliott Forbes, Zhenqian Zhang, Randy Widialaksono, Rangeen Basu Roy Chowdhury, Nyunyi M. Tshibangu, Steve Lipa, W. Rhett Davis, Paul D. Franzon:
Rationale for a 3D heterogeneous multi-core processor. ICCD 2013: 154-168
[c57]
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  - conf/iscas/FranzonPLDT13
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Paul D. Franzon, Shivam Priyadarshi, Steve Lipa, W. Rhett Davis, Thorlindur Thorolfsson:
Exploring early design tradeoffs in 3DIC. ISCAS 2013: 545-549
2012
[c54]
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Thorlindur Thorolfsson, Steve Lipa, Paul D. Franzon:
A 10.35 mW/GFlop stacked SAR DSP unit using fine-grain partitioned 3D integration. CICC 2012: 1-4
2010
[c41]
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  - conf/3dic/LipaTF10
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Steve Lipa, Thorlindur Thorolfsson, Paul D. Franzon:
The NCSU Tezzaron design kit. 3DIC 2010: 1-15
2008
[c30]
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  - conf/dac/FranzonDSLOTMLDBSO08
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Paul D. Franzon, W. Rhett Davis, Michael B. Steer, Steve Lipa, Eun Chu Oh, Thorlindur Thorolfsson, Samson Melamed, Sonali Luniya, Tad Doxsee, Stephen Berkeley, Ben Shani, Kurt Obermiller:
Design and CAD for 3D integrated circuits. DAC 2008: 668-673

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