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Cheng Li

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with Qi Chen 0008

> Home > Persons > Cheng Li

Publications

2020
[j120]
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  - journals/access/WangZLCLW20
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  - https://dblp.org/rec/journals/access/WangZLCLW20
Chenkun Wang, Feilong Zhang, Fei Lu, Qi Chen, Cheng Li, Albert Z. Wang:
A Study of Transient Voltage Peaking in Diode-Based ESD Protection Structures in 28nm CMOS. IEEE Access 8: 87164-87172 (2020)
2019
[j88]
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  - journals/tcad/ZhangWLCLWLW19
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  - https://dblp.org/rec/journals/tcad/ZhangWLCLWLW19
Feilong Zhang, Chenkun Wang, Fei Lu, Qi Chen, Cheng Li, X. Shawn Wang, Daguang Li, Albert Z. Wang:
A Full-Chip ESD Protection Circuit Simulation and Fast Dynamic Checking Method Using SPICE and ESD Behavior Models. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 38(3): 489-498 (2019)
2018
[c108]
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  - conf/rws/WangLCZLWW18
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Chenkun Wang, Fei Lu, Qi Chen, Feilong Zhang, Cheng Li, Dawn Wang, Albert Z. Wang:
A study of impacts of ESD protection on 28/38GHz RF switches in 45nm SOI CMOS for 5G mobile applications. RWS 2018: 157-160
[c107]
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  - conf/rws/ChenWZLW18
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Qi Chen, Chenkun Wang, Feilong Zhang, Cheng Li, Albert Z. Wang:
3D heterogeneous integration enabling future RF ICs. RWS 2018: 188-190
2017
[c104]
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  - conf/asicon/ChenLLWZWXZLNXC17
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Qi Chen, Cheng Li, Fei Lu, Chenkun Wang, Feilong Zhang, Tianru Wu, Xiaoming Xie, Kun Zhang, Xinxin Li, Jimmy Ng, Ya-Hong Xie, Yuhua Cheng, Albert Z. Wang:
Characterization of single-crystalline graphene ESD interconnects. ASICON 2017: 977-980
[c93]
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  - conf/lascas/Wang0CWLZ17
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Albert Z. Wang, Fei Lu, Qi Chen, Chenkun Wang, Cheng Li, Feilong Zhang:
Key note: Integrated design-for-reliability for ICs. LASCAS 2017: 1-4
[c91]
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  - conf/nems/WangCLLWZWNXMWL17
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Albert Z. Wang, Qi Chen, Cheng Li, Fei Lu, Chenkun Wang, Feilong Zhang, X. Shawn Wang, Jimmy Ng, Ya-Hong Xie, Rui Ma, Li Wang, Lin Lin:
More-Than-Moore: 3D heterogeneous integration into CMOS technologies. NEMS 2017: 1-4
[c90]
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Qi Chen, Cheng Li, Fei Lu, Chenkun Wang, Feilong Zhang, Albert Z. Wang, Jimmy Ng, Ya-Hong Xie:
TLP measurement and analysis of graphene NEMS switches for on-chip ESD protection. NEMS 2017: 370-374
2016
[j55]
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  - journals/tcas/0004MDWZWCWZLTC16
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Fei Lu, Rui Ma, Zongyu Dong, Li Wang, Chen Zhang, Chenkun Wang, Qi Chen, X. Shawn Wang, Feilong Zhang, Cheng Li, He Tang, Yuhua Cheng, Albert Z. Wang:
A Systematic Study of ESD Protection Co-Design With High-Speed and High-Frequency ICs in 28 nm CMOS. IEEE Trans. Circuits Syst. I Regul. Pap. 63-I(10): 1746-1757 (2016)

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