Winco K. C. Yung

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	2011
j3		Asit Kumar Gain, Y. C. Chan, Winco K. C. Yung: Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO₂ composite solder on flexible ball grid array substrates. Microelectronics Reliability 51(5): 975-984 (2011)
j2		Asit Kumar Gain, Y. C. Chan, Winco K. C. Yung: Effect of additions of ZrO₂ nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads. Microelectronics Reliability 51(12): 2306-2313 (2011)
	2010
c1		Tama Fouzder, Asit Kumar Gain, Y. C. Chan, Ahmed Sharif, Winco K. C. Yung: Effect of nano Al₂O₃ additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads. Microelectronics Reliability 2010: 2051-2058
	2009
j1		Asit Kumar Gain, Y. C. Chan, Ahmed Sharif, N. B. Wong, Winco K. C. Yung: Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages. Microelectronics Reliability 49(7): 746-753 (2009)

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