Clair Webb

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	2006
c2		Bryan Black, Murali Annavaram, Ned Brekelbaum, John DeVale, Lei Jiang, Gabriel H. Loh, Don McCaule, Pat Morrow, Donald W. Nelson, Daniel Pantuso, Paul Reed, Jeff Rupley, Sadasivan Shankar, John Paul Shen, Clair Webb: Die Stacking (3D) Microarchitecture. MICRO 2006: 469-479
	2004
c1		Bryan Black, Donald Nelson, Clair Webb, Nick Samra: 3D Processing Technology and Its Impact on iA32 Microprocessors. ICCD 2004: 316-318

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