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 | 2010 | |
|---|---|---|
| c2 |      | Yann Civale, Marcel Gonzalez, Deniz Sabuncuoglu Tezcan, Youssef Travaly, Philippe Soussan, Eric Beyne: A novel concept for ultra-low capacitance via-last TSV. 3DIC 2010: 1-4 |
| 2009 | ||
| c1 | | Yann Civale, Deniz Sabuncuoglu Tezcan, Harold G. G. Philipsen, P. Jaenen, Rahul Agarwal, F. Duval, Philippe Soussan, Youssef Travaly, Eric Beyne: Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping. 3DIC 2009: 1-4 |
| 2003 | ||
| j1 | | Philippe Soussan, G. Lekens, R. Dreesen, Ward De Ceuninck, Eric Beyne: Advantage of In-situ over Ex-situ techniques as reliability tool: Aging kinetics of Imec's MCM-D discrete passives devices. Microelectronics Reliability 43(9-11): 1785-1790 (2003) |
| 1 | Rahul Agarwal | |
| 2 | Eric Beyne | |
| 3 | Ward De Ceuninck | |
| 4 | Yann Civale | |
| 5 | R. Dreesen | |
| 6 | F. Duval | |
| 7 | Marcel Gonzalez | |
| 8 | P. Jaenen | |
| 9 | G. Lekens | |
| 10 | Harold G. G. Philipsen | |
| 11 | Deniz Sabuncuoglu Tezcan | |
| 12 | Youssef Travaly |
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