Tomohiro Shimizu

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	2011
c2		Fumihiro Inoue, Harold Philipsen, Alex Radisic, Silvia Armini, Peter Leunissen, Hiroshi Miyake, Ryohei Arima, Tomohiro Shimizu, Toshiaki Ito, Hirofumi Seki, Yuko Shinozaki, Tomohiko Yamamoto, Shoso Shingubara: Low temperature through-Si via fabrication using electroless deposition. 3DIC 2011: 1-4
	2010
c1		Fumihiro Inoue, Takumi Yokoyama, Hiroshi Miyake, Shukichi Tanaka, Toshifumi Terui, Tomohiro Shimizu, Shoso Shingubara: All-wet fabrication technology for high aspect ratio TSV using electroless barrier and seed layers. 3DIC 2010: 1-5

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