- CSB - MetaPress - Google - Bing - Yahoo
 | 2010 | |
|---|---|---|
| c1 |      | Anne Jourdain, Thibault Buisson, Alain Phommahaxay, Mark Privett, Dan Wallace, Sumant Sood, Peter Bisson, Eric Beyne, Youssef Travaly, Bart Swinnen: 300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications. 3DIC 2010: 1-4 |
| 1 | Eric Beyne | |
| 2 | Peter Bisson | |
| 3 | Thibault Buisson | |
| 4 | Anne Jourdain | |
| 5 | Alain Phommahaxay | |
| 6 | Sumant Sood | |
| 7 | Bart Swinnen | |
| 8 | Youssef Travaly | |
| 9 | Dan Wallace |
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