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 | 2011 | |
|---|---|---|
| j1 |      | Ingrid De Wolf, K. Croes, O. Varela Pedreira, Riet Labie, A. Redolfi, M. Van De Peer, Kris Vanstreels, C. Okoro, Bart Vandevelde, Eric Beyne: Cu pumping in TSVs: Effect of pre-CMP thermal budget. Microelectronics Reliability 51(9-11): 1856-1859 (2011) |
| 1 | Eric Beyne | |
| 2 | K. Croes | |
| 3 | Riet Labie | |
| 4 | O. Varela Pedreira | |
| 5 | M. Van De Peer | |
| 6 | A. Redolfi | |
| 7 | Bart Vandevelde | |
| 8 | Kris Vanstreels | |
| 9 | Ingrid De Wolf |
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