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You can find the classic dblp view of this page here.
Ronghai Mao
2010 – today
- 2012
[j2]Fei Su, Ronghai Mao, Ji Xiong, Kun Zhou, Zheng Zhang, Jiang Shao, Cunyi Xie: On thermo-mechanical reliability of plated-through-hole (PTH). Microelectronics Reliability 52(6): 1189-1196 (2012)- 2011
[j1]Fei Su, Ronghai Mao, Xiaoyan Wang, Guangzhou Wang, Haiyan Pan: Creep behaviour of Sn-3.8Ag-0.7Cu under the effect of electromigration: Experiments and modelling. Microelectronics Reliability 51(5): 1020-1024 (2011)
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last updated on 2012-09-10 16:02 CEST by the dblp team



