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 | 2003 | |
|---|---|---|
| j4 |      | G. Lefranc, B. Weiss, C. Klos, J. Dick, G. Khatibi, H. Berg: Aluminum bond-wire properties after 1 billion mechanical cycles. Microelectronics Reliability 43(9-11): 1833-1838 (2003) |
| j3 | | G. Coquery, G. Lefranc, T. Licht, Richard Lallemand, N. Seliger, H. Berg: High temperature reliability on automotive power modules verified by power cycling tests up to 150degreeC. Microelectronics Reliability 43(9-11): 1871-1876 (2003) |
| 2002 | ||
| j2 | | N. Seliger, E. Wolfgang, G. Lefranc, H. Berg, T. Licht: Reliable power electronics for automotive applications. Microelectronics Reliability 42(9-11): 1597-1604 (2002) |
| j1 | | G. Lefranc, T. Licht, G. Mitic: Properties of solders and their fatigue in power modules. Microelectronics Reliability 42(9-11): 1641-1646 (2002) |
| 1 | H. Berg | |
| 2 | Gerard Coquery (G. Coquery) | |
| 3 | J. Dick | |
| 4 | G. Khatibi | |
| 5 | C. Klos | |
| 6 | Richard Lallemand | |
| 7 | T. Licht | |
| 8 | G. Mitic | |
| 9 | N. Seliger | |
| 10 | B. Weiss | |
| 11 | E. Wolfgang |
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