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Dim-Lee Kwong
2010 – today
- 2012
[j2]HongYu Yu, Yuan Sun, Navab Singh, Guo-Qiang Lo, Dim-Lee Kwong: Perspective of flash memory realized on vertical Si nanowires. Microelectronics Reliability 52(4): 651-661 (2012)
[c3]Liang Lou, Songsong Zhang, Woo-Tae Park, Lishiah Lim, Dim-Lee Kwong, Chengkuo Lee: Characterization of a multi-layered MEMS pressure sensor using piezoresistive silicon nanowire within large measurable strain range. NEMS 2012: 99-103- 2011
[c2]Xiaowu Zhang, Ranjan Rajoo, F. X. Che, C. S. Selvanayagam, W. K. Choi, Shan Gao, Guo-Qiang Lo, Dim-Lee Kwong: A low stress bond pad design optimization of low temperature solder interconnections on TSVs for MEMS applications. 3DIC 2011: 1-5- 2010
[c1]Lan Peng, Hongyu Li, Dau Fatt Lim, Riko I. Made, Guo-Qiang Lo, Dim-Lee Kwong, Chuan Seng Tan: Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement. 3DIC 2010: 1-5
2000 – 2009
- 2002
[j1]Carlton M. Osburn, Indong Kim, Sungkee Han, Indranil De, Kam F. Yee, Shyam Gannavaram, SungJoo Lee, Chung-Ho Lee, Zhijiong J. Luo, Wenjuan Zhu, John R. Hauser, Dim-Lee Kwong, Gerald Lucovsky, T. P. Ma, Mehmet C. Öztürk: Vertically scaled MOSFET gate stacks and junctions: How far are we likely to go? IBM Journal of Research and Development 46(2-3): 299-316 (2002)
Coauthor Index
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last updated on 2012-09-10 15:45 CEST by the dblp team



