Anne Jourdain

Y. H. Hu, C. S. Liu, M. J. Lii, K. J. Rebibis, Anne Jourdain, Antonio La Manna, Gerald Beyer, Eric Beyne, C. H. Yu: 3D stacking using Cu-Cu direct bonding. 3DIC 2011: 1-4

Alain Phommahaxay, Anne Jourdain, Greet Verbinnen, Tobias Woitke, Peter Bisson, Markus Gabriel, Walter Spiess, Alice Guerrero, Jeremy McCutcheon, Rama Puligadda, Pieter Bex, Axel Van den Eede, Bart Swinnen, Gerald Beyer, Andy Miller, Eric Beyne: Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding. 3DIC 2011: 1-4

Anne Jourdain, Thibault Buisson, Alain Phommahaxay, Mark Privett, Dan Wallace, Sumant Sood, Peter Bisson, Eric Beyne, Youssef Travaly, Bart Swinnen: 300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications. 3DIC 2010: 1-4

Ramakanth Alapati, Youssef Travaly, Jan Van Olmen, Ricardo Cotrin Teixeira, Jan Vaes, Marc van Cauwenbergh, Anne Jourdain, Greet Verbinnen, Gino Marcuccilli, Glenn Florence, Shay Wolfling, Christine Pelissier, Haiping Zhang, Jaydeep Sinha, Andreas Machura, Irfan Malik: TSV metrology and inspection challenges. 3DIC 2009: 1-4

Jan Van Olmen, Jan Coenen, Wim Dehaene, Kristin De Meyer, Cedric Huyghebaert, Anne Jourdain, Guruprasad Katti, Abdelkarim Mercha, Michal Rakowski, Michele Stucchi, Youssef Travaly, Eric Beyne, Bart Swinnen: 3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV). 3DIC 2009: 1-5