Gweltaz Gaudin

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	2010
c3		Gweltaz Gaudin, Gregory Riou, Didier Landru, Catherine Tempesta, Ionut Radu, Mariam Sadaka, Kevin Winstel, Emily Kinser, Robert Hannon: Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment. 3DIC 2010: 1-4
c2		Ionut Radu, Didier Landru, Gweltaz Gaudin, Gregory Riou, Catherine Tempesta, F. Letertre, Léa Di Cioccio, Pierric Gueguen, Thomas Signamarcheix, C. Euvrard, Jérôme Dechamp, Laurent Clavelier, Mariam Sadaka: Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking. 3DIC 2010: 1-6
c1		Gregory Riou, Gweltaz Gaudin, Didier Landru, Catherine Tempesta, Ionut Radu, Mariam Sadaka, Kevin Winstel, Emily Kinser, Robert Hannon, Boris V. Kamenev, Michael Darwin, Robert Sachs: Pre bonding metrology solutions for 3D integration. 3DIC 2010: 1-5

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