| 2010 | ||
|---|---|---|
| j3 | Zhaozheng Hu, Ronald Chung, Kenneth S. M. Fung: EC-EGI: enriched complex EGI for 3D shape registration. Mach. Vis. Appl. 21(2): 177-188 (2010) | |
| 2009 | ||
| j2 | Ada N. Y. Ng, Edmund Y. Lam, Ronald Chung, Kenneth S. M. Fung, W. H. Leung: Reference-Free Machine Vision Inspection of semiconductor die Images. Int. J. Image Graphics 9(1): 133-152 (2009) | |
| 2008 | ||
| c3 | Jun Cheng, Ronald Chung, Edmund Y. Lam, Kenneth S. M. Fung: Handling of multi-reflections in wafer bump 3D reconstruction. SMC 2008: 1558-1561 | |
| 2007 | ||
| j1 | Jun Cheng, Ronald Chung, Edmund Y. Lam, Kenneth S. M. Fung, Yangsheng Xu: Optimization of Bit-Pairing Codification with Learning for 3D Reconstruction. Int. J. Image Graphics 7(3): 445-462 (2007) | |
| c2 | Mei Dong, Ronald Chung, Edmund Y. Lam, Kenneth S. M. Fung: Use of Paraplanar Constraint for Parallel Inspection of Wafer Bump Heights. IPCV 2007: 157-163 | |
| 2006 | ||
| c1 | Jun Cheng, Ronald Chung, Edmund Y. Lam, Kenneth S. M. Fung: Bit-pairing Codification for Binary Pattern Projection System. ICPR (2) 2006: 263-266 | |
| 1 | Jun Cheng | |
| 2 | Ronald Chung (Ronald Chi-kit Chung) | |
| 3 | Mei Dong | |
| 4 | Zhaozheng Hu | |
| 5 | Edmund Y. Lam | |
| 6 | W. H. Leung | |
| 7 | Ada N. Y. Ng | |
| 8 | Yangsheng Xu |
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