- CSB - MetaPress - Google - Bing - Yahoo
 | 2013 | |
|---|---|---|
| c5 |      | Patrick Ruch, Thomas Brunschwiler, Stephan Paredes, Gerhard Ingmar Meijer, Bruno Michel: Roadmap towards ultimately-efficient zeta-scale datacenters. DATE 2013: 1339-1344 |
| 2012 | ||
| j6 | | Patrick Ruch, Thomas Brunschwiler, Werner Escher, Stephan Paredes, Bruno Michel: Bionic Packaging: A Promising Paradigm for Future Computing. ERCIM News 2012(89) (2012) |
| 2011 | ||
| j5 | | Patrick Ruch, Thomas Brunschwiler, Werner Escher, Stephan Paredes, Bruno Michel: Toward five-dimensional scaling: How density improves efficiency in future computers. IBM Journal of Research and Development 55(5): 15 (2011) |
| j4 | | Mohamed M. Sabry, Ayse Kivilcim Coskun, David Atienza, Tajana Simunic Rosing, Thomas Brunschwiler: Energy-Efficient Multiobjective Thermal Control for Liquid-Cooled 3-D Stacked Architectures. IEEE Trans. on CAD of Integrated Circuits and Systems 30(12): 1883-1896 (2011) |
| c4 | | Mohamed M. Sabry, Arvind Sridhar, David Atienza, Yuksel Temiz, Yusuf Leblebici, S. Szczukiewicz, N. Borhani, J. R. Thome, Thomas Brunschwiler, Bruno Michel: Towards thermally-aware design of 3D MPSoCs with inter-tier cooling. DATE 2011: 1466-1471 |
| 2010 | ||
| c3 | | Ayse Kivilcim Coskun, David Atienza, Tajana Simunic Rosing, Thomas Brunschwiler, Bruno Michel: Energy-efficient variable-flow liquid cooling in 3D stacked architectures. DATE 2010: 111-116 |
| c2 | | Arvind Sridhar, Alessandro Vincenzi, Martino Ruggiero, Thomas Brunschwiler, David Atienza: 3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling. ICCAD 2010: 463-470 |
| 2009 | ||
| j3 | | Gerhard Ingmar Meijer, Thomas Brunschwiler, Stephan Paredes, Bruno Michel: Using Waste Heat from Data Centres to Minimize Carbon Dioxide Emission. ERCIM News 2009(79) (2009) |
| j2 | | Thomas Brunschwiler, Brian Smith, E. Ruetsche, Bruno Michel: Toward zero-emission data centers through direct reuse of thermal energy. IBM Journal of Research and Development 53(3): 11 (2009) |
| j1 | | Brian Smith, Thomas Brunschwiler, Bruno Michel: Comparison of transient and static test methods for chip-to-sink thermal interface characterization. Microelectronics Journal 40(9): 1379-1386 (2009) |
| c1 | | Thomas Brunschwiler, Stephan Paredes, Ute Drechsler, Bruno Michel, W. Cesar, G. Toral, Yuksel Temiz, Yusuf Leblebici: Validation of the porous-medium approach to model interlayer-cooled 3D-chip stacks. 3DIC 2009: 1-10 |
Data released under the ODC-BY 1.0 license — See also our legal information page