| 2001 | ||
|---|---|---|
| j1 | Warren R. Anderson, William M. Gonzalez, Sheera S. Knecht, Wendy Fowler: Reliability considerations for ESD protection under wire bonding pads. Microelectronics Reliability 41(3): 367-373 (2001) | |
| 1 | Wendy Fowler | |
| 2 | William M. Gonzalez | |
| 3 | Sheera S. Knecht |
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