 | 2011 |
| c5 |  | G. Druais, Pascal Ancey, C. Aumont, V. Caubet, Laurent-Luc Chapelon, C. Chaton, Séverine Cheramy, S. Cordova, E. Cirot, J.-P. Colonna, P. Coudrain, T. Divel, Y. Dodo, Alexis Farcy, N. Guitard, K. Haxaire, N. Hotellier, F. Leverd, R. Liou, J. Michailos, A. Ostrovsky, S. Petitdidier, J. Pruvost, D. Riquet, O. Robin, E. Saugier, Nicolas Sillon: 3D integration demonstration of a wireless product with design partitioning. 3DIC 2011: 1-5 |
| 2009 |
| c4 |  | Lionel Cadix, Alexis Farcy, Cédric Bermond, Christine Fuchs, Patrick Leduc, Maxime Rousseau, Myriam Assous, Alexandre Valentian, Julie Roullard, Elie Eid, Nicolas Sillon, Bernard Fléchet, Pascal Ancey: Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits. 3DIC 2009: 1-7 |
| c3 |  | |
| c2 |  | |
| 2008 |
| j1 |  | |
| c1 |  | |
| i1 |  | |