BibTeX records: Cadmus A. Yuan

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@article{DBLP:journals/ress/QianFFYZ16,
  author       = {C. Qian and
                  X. J. Fan and
                  J. J. Fan and
                  Cadmus A. Yuan and
                  Guo Qi Zhang},
  title        = {An accelerated test method of luminous flux depreciation for {LED}
                  luminaires and lamps},
  journal      = {Reliab. Eng. Syst. Saf.},
  volume       = {147},
  pages        = {84--92},
  year         = {2016},
  url          = {https://doi.org/10.1016/j.ress.2015.11.009},
  doi          = {10.1016/J.RESS.2015.11.009},
  timestamp    = {Tue, 25 Feb 2020 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/ress/QianFFYZ16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/LiuSZXYZ15,
  author       = {Yang Liu and
                  Fenglian Sun and
                  Hao Zhang and
                  Tong Xin and
                  Cadmus A. Yuan and
                  Guoqi Zhang},
  title        = {Interfacial reaction and failure mode analysis of the solder joints
                  for flip-chip {LED} on {ENIG} and Cu-OSP surface finishes},
  journal      = {Microelectron. Reliab.},
  volume       = {55},
  number       = {8},
  pages        = {1234--1240},
  year         = {2015},
  url          = {https://doi.org/10.1016/j.microrel.2015.05.005},
  doi          = {10.1016/J.MICROREL.2015.05.005},
  timestamp    = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/LiuSZXYZ15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/LiuLZWYZSL14,
  author       = {Yang Liu and
                  Stanley Y. Y. Leung and
                  Jia Zhao and
                  Cell K. Y. Wong and
                  Cadmus A. Yuan and
                  Guoqi Zhang and
                  Fenglian Sun and
                  Liangliang Luo},
  title        = {Thermal and mechanical effects of voids within flip chip soldering
                  in {LED} packages},
  journal      = {Microelectron. Reliab.},
  volume       = {54},
  number       = {9-10},
  pages        = {2028--2033},
  year         = {2014},
  url          = {https://doi.org/10.1016/j.microrel.2014.07.034},
  doi          = {10.1016/J.MICROREL.2014.07.034},
  timestamp    = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/LiuLZWYZSL14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/YeLTZYZ14,
  author       = {Huaiyu Ye and
                  Bo Li and
                  Hongyu Tang and
                  Jia Zhao and
                  Cadmus A. Yuan and
                  Guoqi Zhang},
  title        = {Design of vertical fin arrays with heat pipes used for high-power
                  light-emitting diodes},
  journal      = {Microelectron. Reliab.},
  volume       = {54},
  number       = {11},
  pages        = {2448--2455},
  year         = {2014},
  url          = {https://doi.org/10.1016/j.microrel.2014.05.004},
  doi          = {10.1016/J.MICROREL.2014.05.004},
  timestamp    = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/YeLTZYZ14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/YuanSDZ08,
  author       = {Cadmus A. Yuan and
                  Olaf van der Sluis and
                  Willem D. van Driel and
                  G. Q. (Kouchi) Zhang},
  title        = {The need for multi-scale approaches in Cu/low-k reliability issues},
  journal      = {Microelectron. Reliab.},
  volume       = {48},
  number       = {6},
  pages        = {833--842},
  year         = {2008},
  url          = {https://doi.org/10.1016/j.microrel.2008.03.024},
  doi          = {10.1016/J.MICROREL.2008.03.024},
  timestamp    = {Sat, 30 Sep 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/YuanSDZ08.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/YuanSZEDS07,
  author       = {Cadmus A. Yuan and
                  Olaf van der Sluis and
                  G. Q. (Kouchi) Zhang and
                  Leo J. Ernst and
                  Willem D. van Driel and
                  Richard B. R. van Silfhout},
  title        = {Molecular simulation on the material/interfacial strength of the low-dielectric
                  materials},
  journal      = {Microelectron. Reliab.},
  volume       = {47},
  number       = {9-11},
  pages        = {1483--1491},
  year         = {2007},
  url          = {https://doi.org/10.1016/j.microrel.2007.07.052},
  doi          = {10.1016/J.MICROREL.2007.07.052},
  timestamp    = {Sat, 30 Sep 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/YuanSZEDS07.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/DrielYYKZ07,
  author       = {Willem D. van Driel and
                  Dao{-}Guo Yang and
                  Cadmus A. Yuan and
                  M. van Kleef and
                  G. Q. (Kouchi) Zhang},
  title        = {Mechanical reliability challenges for {MEMS} packages: Capping},
  journal      = {Microelectron. Reliab.},
  volume       = {47},
  number       = {9-11},
  pages        = {1823--1826},
  year         = {2007},
  url          = {https://doi.org/10.1016/j.microrel.2007.07.033},
  doi          = {10.1016/J.MICROREL.2007.07.033},
  timestamp    = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/DrielYYKZ07.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/YuanDSSEEKZ06,
  author       = {Cadmus A. Yuan and
                  Willem D. van Driel and
                  Richard B. R. van Silfhout and
                  Olaf van der Sluis and
                  Roy A. B. Engelen and
                  Leo J. Ernst and
                  Fred van Keulen and
                  G. Q. Zhang},
  title        = {Delamination analysis of Cu/low-k technology subjected to chemical-mechanical
                  polishing process conditions},
  journal      = {Microelectron. Reliab.},
  volume       = {46},
  number       = {9-11},
  pages        = {1679--1684},
  year         = {2006},
  url          = {https://doi.org/10.1016/j.microrel.2006.07.054},
  doi          = {10.1016/J.MICROREL.2006.07.054},
  timestamp    = {Sat, 30 Sep 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/YuanDSSEEKZ06.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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