BibTeX records: J. D. Wu

• > Home > Persons > J. D. Wu

@article{DBLP:journals/mr/WuZLHL06,
  author       = {J. D. Wu and
                  P. J. Zheng and
                  C. W. Lee and
                  S. C. Hung and
                  J. J. Lee},
  title        = {A study in flip-chip UBM/bump reliability with effects of SnPb solder
                  composition},
  journal      = {Microelectron. Reliab.},
  volume       = {46},
  number       = {1},
  pages        = {41--52},
  year         = {2006},
  url          = {https://doi.org/10.1016/j.microrel.2005.01.012},
  doi          = {10.1016/J.MICROREL.2005.01.012},
  timestamp    = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/WuZLHL06.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/ChenWC06a,
  author       = {Kuo{-}Ming Chen and
                  J. D. Wu and
                  Kuo{-}Ning Chiang},
  title        = {Effects of pre-bump probing and bumping processes on eutectic solder
                  bump electromigration},
  journal      = {Microelectron. Reliab.},
  volume       = {46},
  number       = {12},
  pages        = {2104--2111},
  year         = {2006},
  url          = {https://doi.org/10.1016/j.microrel.2006.01.005},
  doi          = {10.1016/J.MICROREL.2006.01.005},
  timestamp    = {Sun, 02 Oct 2022 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/ChenWC06a.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/WuHL03,
  author       = {J. D. Wu and
                  C. Y. Huang and
                  C. C. Liao},
  title        = {Fracture strength characterization and failure analysis of silicon
                  dies},
  journal      = {Microelectron. Reliab.},
  volume       = {43},
  number       = {2},
  pages        = {269--277},
  year         = {2003},
  url          = {https://doi.org/10.1016/S0026-2714(02)00314-1},
  doi          = {10.1016/S0026-2714(02)00314-1},
  timestamp    = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/WuHL03.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/ZhengLLWH03,
  author       = {Po{-}Jen Zheng and
                  J. Z. Lee and
                  K. H. Liu and
                  J. D. Wu and
                  S. C. Hung},
  title        = {Solder joint reliability of {TFBGA} assemblies with fresh and reworked
                  solder balls},
  journal      = {Microelectron. Reliab.},
  volume       = {43},
  number       = {6},
  pages        = {925--934},
  year         = {2003},
  url          = {https://doi.org/10.1016/S0026-2714(03)00072-6},
  doi          = {10.1016/S0026-2714(03)00072-6},
  timestamp    = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/ZhengLLWH03.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/WuHHLZH02,
  author       = {J. D. Wu and
                  S. H. Ho and
                  C. Y. Huang and
                  C. C. Liao and
                  P. J. Zheng and
                  S. C. Hung},
  title        = {Board level reliability of a stacked {CSP} subjected to cyclic bending},
  journal      = {Microelectron. Reliab.},
  volume       = {42},
  number       = {3},
  pages        = {407--416},
  year         = {2002},
  url          = {https://doi.org/10.1016/S0026-2714(01)00241-4},
  doi          = {10.1016/S0026-2714(01)00241-4},
  timestamp    = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/WuHHLZH02.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/HungZHLCW01,
  author       = {S. C. Hung and
                  P. J. Zheng and
                  S. H. Ho and
                  S. C. Lee and
                  H. N. Chen and
                  J. D. Wu},
  title        = {Board level reliability of {PBGA} using flex substrate},
  journal      = {Microelectron. Reliab.},
  volume       = {41},
  number       = {5},
  pages        = {677--687},
  year         = {2001},
  url          = {https://doi.org/10.1016/S0026-2714(01)00003-8},
  doi          = {10.1016/S0026-2714(01)00003-8},
  timestamp    = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/HungZHLCW01.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}