BibTeX records: J. S. Pan

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@article{DBLP:journals/mr/LinDLCYPCTT03,
  author       = {T. Y. Lin and
                  K. L. Davison and
                  W. S. Leong and
                  Simon Chua and
                  Y. F. Yao and
                  J. S. Pan and
                  J. W. Chai and
                  K. C. Toh and
                  W. C. Tjiu},
  title        = {Surface topographical characterization of silver-plated film on the
                  wedge bondability of leaded {IC} packages},
  journal      = {Microelectron. Reliab.},
  volume       = {43},
  number       = {5},
  pages        = {803--809},
  year         = {2003},
  url          = {https://doi.org/10.1016/S0026-2714(03)00037-4},
  doi          = {10.1016/S0026-2714(03)00037-4},
  timestamp    = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/LinDLCYPCTT03.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/LinLCOMPC02,
  author       = {T. Y. Lin and
                  W. S. Leong and
                  K. H. Chua and
                  R. Oh and
                  Y. Miao and
                  J. S. Pan and
                  J. W. Chai},
  title        = {The impact of copper contamination on the quality of the second wire
                  bonding process using X-ray photoelectron spectroscopy method},
  journal      = {Microelectron. Reliab.},
  volume       = {42},
  number       = {3},
  pages        = {375--380},
  year         = {2002},
  url          = {https://doi.org/10.1016/S0026-2714(02)00003-3},
  doi          = {10.1016/S0026-2714(02)00003-3},
  timestamp    = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/LinLCOMPC02.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}