Volume 9, Number 1/2, 2006
Mark J. Jackson: Micro-grinding electronic and optical materials using diamond-coated piezoelectric materials. 1-17- Nobuyuki Moronuki, Yasunori Saito, Arata Kaneko: Vibration micro-machining of low-melting temperature glass. 18-33
- Noritaka Kawasegi, Noboru Morita, Shigeru Yamada, Noboru Takano, Tatsuo Oyama, Kiwamu Ashida, Jun Taniguchi, Iwao Miyamoto, Sadao Momota: Etching characteristics of a silicon surface induced by focused ion beam irradiation. 34-50
- Nobuhito Yoshihara, Tsunemoto Kuriyagawa, Hiromichi Ono, Katsuo Syoji: Nano-topography on axisymmetric aspherical ground surfaces. 51-63
- Kiyoshi Suzuki, Yoshiaki Shishido, Nobuhiro Koga, Takeki Shirai, Manabu Iwai, Tetsutaro Uematsu: Development of a crack cutting method for glass plates used for flat panel displays. 64-78
- Katsutoshi Tanaka, Masahiko Fukuta, Kiyoshi Suzuki, Manabu Iwai, Tetsutaro Uematsu, Syoji Mishiro: Improvement of grinding performance in ultra-precision grinding of lens mould by the help of megasonic coolant. 79-93
- Kiyoshi Suzuki, Manabu Iwai, Anurag Sharma, Sadao Sano, Tetsutaro Uematsu: Low-wear diamond electrode for micro-EDM of die-steel. 94-108
- Tsuyoshi Kaku, Tsunemoto Kuriyagawa, Nobuhito Yoshihara: Electrorheological fluid-assisted polishing of WC micro aspherical glass moulding dies. 109-119
- Jun Shimizu, Libo Zhou, Hiroshi Eda: Molecular dynamics simulation of vibration-assisted cutting: influences of vibration parameters. 120-129
- Libo Zhou, Zhongjun Qiu, Tomohiko Ishikawa, Tatsuo Kawakami, Hiroshi Eda: Development of vision controlled bio-cell manipulation system. 130-143
- Arvind Chandrasekaran, Muthukumaran Packirisamy, Ion Stiharu, Andre Delage: Hybrid bulk micro-machining process suitable for roughness reduction in optical MEMS devices. 144-159
- Yongbo Wu, Masana Kato: Geometrical arrangement of ID grinding wheel in simultaneous-ID/OD combination centreless grinding. 160-171
- Nobuo Yasunaga, Yukiharu Yamamoto: High temperature MCP process suitable for extremely hard high functional SiC wafers. 172-182
- Xijun Kang, Jun'ichi Tamaki, Akihiko Kubo: Effect of cutting edge truncation on ductile-regime grinding of hard and brittle materials. 183-200
Volume 9, Number 3/4, 2006
- Toshimichi Moriwaki, Keiichi Shirase: Intelligent machine tools: current status and evolutional architecture. 204-218
- Zezhong C. Chen, Zhibin Miao: An intelligent approach to non-constant feed rate determination for high-performance 2D CNC milling. 219-236
- Dusan N. Sormaz, Deepak V. Pisipati, Prashant A. Borse: Virtual manufacturing of milling operations with multiple tool paths. 237-264
- Pingjun Xia, Yingxue Yao, Jiangsheng Liu, Jianguang Li: Optimising assembly planning based on virtual reality and bionic algorithm. 265-293
- Da-Yin Liao, Min-Yi Tsai: A quota-constrained, speed control model for production scheduling in semiconductor manufacturing. 294-308
- Qi Hao, Weiming Shen, Lihui Wang: Collaborative manufacturing resource scheduling using Agent-based Web Services. 309-327
- Matthew Chiu, Hao Wen Lin, Sev V. Nagalingam, Grier C. I. Lin: Inter-operability framework towards virtual integration of SMEs in the manufacturing industry. 328-349
- V. Dhanalakshmi, K. Sankaranarayanasamy, Subramaniam Arunachalam, S. C. Lenny Koh: Extraction of simple and concatenated features from a wire frame model using IGES data. 350-371
- Gerald Weigert, Sebastian Werner, Sven Horn: Simulation aided optimisation of manufacturing processes in university education. 372-386
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last updated on 2013-06-18T214307 by the dblp team