Jongwoo Park

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2009

2 Joono Cheong, Jongwoo Park, Silviu-Iulian Niculescu: Physically Based Collaborative Simulations under Ring-Like Network Configurations. IEEE Computer Graphics and Applications 29(4): 64-80 (2009)

2006

1 Jongwoo Park, John Osenbach: Processability and reliability of epoxy adhesive used in microelectronic devices linked to effects of degree of cure and damp heat aging. Microelectronics Reliability 46(2-4): 503-511 (2006)

	2009
2		Joono Cheong, Jongwoo Park, Silviu-Iulian Niculescu: Physically Based Collaborative Simulations under Ring-Like Network Configurations. IEEE Computer Graphics and Applications 29(4): 64-80 (2009)
	2006
1		Jongwoo Park, John Osenbach: Processability and reliability of epoxy adhesive used in microelectronic devices linked to effects of degree of cure and damp heat aging. Microelectronics Reliability 46(2-4): 503-511 (2006)

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