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| 2006 | ||
|---|---|---|
| 1 | Dan O. Popa, Rakesh Murthy, Manoj Mitta, Jeongsik Sin, Harry E. Stephanou: M3-Modular Multi-Scale Assembly System for MEMS Packaging. IROS 2006: 3712-3717 | |
| 1 | Rakesh Murthy | [1] |
| 2 | Dan O. Popa | [1] |
| 3 | Jeongsik Sin | [1] |
| 4 | Harry E. Stephanou | [1] |
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