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| 2006 | ||
|---|---|---|
| 2 | E. Misra, N. D. Theodore, J. W. Mayer, T. L. Alford: Failure mechanisms of pure silver, pure aluminum and silver-aluminum alloy under high current stress. Microelectronics Reliability 46(12): 2096-2103 (2006) | |
| 2005 | ||
| 1 | E. Misra, Md M. Islam, Mahbub Hasan, H. C. Kim, T. L. Alford: Percolative approach for failure time prediction of thin film interconnects under high current stress. Microelectronics Reliability 45(2): 391-395 (2005) | |
| 1 | T. L. Alford | [1] [2] |
| 2 | Mahbub Hasan | [1] |
| 3 | Md M. Islam | [1] |
| 4 | H. C. Kim | [1] |
| 5 | J. W. Mayer | [2] |
| 6 | N. D. Theodore | [2] |
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